Wuxi Jerome Device Handling Products
Wafer Frames
Apllication
- Wafer mount
- Back grinding
- Wafer sawing
- Die attach
- Shipping
Wafer Cassette

Use for handling wafer in the process of
- Wafer slice
- Wafer mount
- Back grinding
Wafer Frame Cassette
Application
- wafer mount
- Back grinding
- Wafer sawing
- Die attach
- Shipping
Normal & Plasma Magazine

1. Total solution to design and produce whole series magazine for LED,Transistor and IC packages;
2. Hundreds of magazine molds available;
3. High quality, low cost and on time delivery.
Use for handling lead frame and substrates in below process :
- Die attach
- Wire bond
- Molding
- Trim/Form
- Plating
- Marking
Metal Tube

Application
- Baking
- Trim/form
- Testing
- Shipping
Stack Magazine

Application
- Molding
- Plating
- Trim/Form
- Marking
- Baking
LED Magazine & Metal Tube

Handling LED lead frame in below process:
- Die attach
- Wire bond
- Molding
- Trim/Form
