Gel-Pak, a division of Delphon Industries LLC, has been manufacturing innovative device carrier products since 1980. Headquartered in Hayward, California, its unique products are designed to provide optimum protection during the shipping and handling of fragile devices.Gel-Pak products (Gel-Box, Gel-Tray, Gel-Slide, VR Tray, and Gel-Film) are manufactured using a proprietary Gel material that effectively immobilizes a device based on surface contact.

Gel-Pak products prevent device damage that can result from contact with the edges or top surface of the carrier. Using surface tension, components are held in place and protected, even if the carrier is tilted, jarred, or turned upside down, yet they can still be easily removed. The same cannot be said for waffle pack or JEDEC trays. Gel-Pak products provide significantly more device protection than a traditional waffle pack or chip tray and eliminate the need for pockets or cavities.

The versatility of the Gel-Pak products allow for a range of device sizes to be stored in a single tray or box enabling the user to effectively minimize their carrier inventory thus reducing both production control and purchasing costs.

All of the products can be customized by optimizing the Gel retention level (the tack or adherence of the Gel) based on the size, weight and surface finish of the customer's device. The carriers are available in transparent, conductive or anti-static materials and can be personalized with a company logo or a grid for device mapping.

The Gel-Box and Gel-TrayTM product families are ideal for manual applications where the device may be removed with tweezers or fingers. The Vacuum ReleaseTM (VR) Trays and the Wafer/Large Substrate Vacuum Release Carriers are designed for environments in which the device may be unloaded manually by a vacuum pen or by an automated piece of equipment such as a die attach or pick-and-place machine. The Gel-Film® material is extremely versatile and is used in a broad range of customer process steps.

INDUSTRIES SERVED

Gel-Pak provides both standard and custom solutions to thousands of companies worldwide serving a wide range of industries. Within each industry, there are numerous applications and device types that depend on Gel-Pak products. These industries include:

Photonics, Optoeletronics, RF/Wireless, Aerospace, Sensors, MEMS, Nanotechnology, Automotive and Consumer

DEVICE TYPES

Bare Die, AFM Tips, Sensors, CMOS Imager, Sensor Coil, Crystals, Laser Diode /Bar, Leadless Packages (QFP/MLF), LED, MMIC, Optical

Filtter, Photo Diode,Probe Card Tips, Thin Film Slider Bar, AWG, KGD, CSP, Fiber Optics, Flat Panel Display, Specialty Holders,

Wafers, mBGA, Glass/Optics, MCM and Substrates.

Gel-Boxes (AD)
Intended for manual applications
Tweezers or Finger
Process B version available  (“Xn-B”)
Large variety of standard box sizes and material types
1”x1” to 7”x5”
C, T, AS, CT, CAS
Special box sizes available on request
Customer supplied boxes  (i.e. Licefa)

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